Keywords
Bistable mechanisms, compliant mechanisms, on-chip actuation
Abstract
A new class of bistable mechanisms, the fully compliant tensural bistable micromechanism (FTBM) class, is introduced. The class consists of linear bistable micromechanisms that undergo tension loads, in addition to the bending loads present, through their range of motion. Proof-of-concept designs fabricated in two different microelectromechanical systems (MEMS) surface micromachining processes were demonstrated. Three sets of refined designs within the FTBM class were designed using optimization methods linked with nonlinear finite element analysis (FEA), then fabricated and tested. Measured force and displacement performance are compared to values obtained by FEA. On-chip actuation of the bistable mechanisms was achieved using thermomechanical in-plane microactuators (TIMs). The FTBM class of bistable mechanisms explores a relatively new design space for fully compliant micromechanisms, and mechanisms from this class have promise in such applications as micro shutter positioning, microvalves, and electrical microrelays.
Original Publication Citation
Wilcox, D.L. and Howell, L.L., "Fully Compliant Tensural Bistable Micro-mechanisms (FTBM)," Journal of Microelectromechanical Systems, Vol. 14, No. 6, pp. 1223-1235, 25.
BYU ScholarsArchive Citation
Wilcox, D. L. and Howell, Larry L., "Fully Compliant Tensural Bistable Micro-mechanisms (FTBM)" (2005). Faculty Publications. 334.
https://scholarsarchive.byu.edu/facpub/334
Document Type
Peer-Reviewed Article
Publication Date
2005-12-05
Permanent URL
http://hdl.lib.byu.edu/1877/1152
Publisher
IEEE
Language
English
College
Ira A. Fulton College of Engineering and Technology
Department
Mechanical Engineering
Copyright Status
© 2005 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.
Copyright Use Information
http://lib.byu.edu/about/copyright/