Keywords
molecular dynamics, intermolecular potentials, MPSA
Abstract
In superconformal filling of copper-chip interconnects, organic additives are used to fill high-aspect-ratio trenches or vias from the bottom up. In this study we report on the development of intermolecular potentials and use molecular dynamics simulation.
Original Publication Citation
Guymon, Clint G., John N. Harb, Richard L. Rowley, and Dean R. Wheeler. "MPSA effects on copper electrodeposition investigated by molecular dynamics simulations." The Journal of Chemical Physics 128 (28)
BYU ScholarsArchive Citation
Harb, John N.; Rowley, Richard L.; Wheeler, Dean R.; and Guymon, Clint G., "MPSA effects on copper electrodeposition investigated by molecular dynamics simulations" (2008). Faculty Publications. 211.
https://scholarsarchive.byu.edu/facpub/211
Document Type
Peer-Reviewed Article
Publication Date
2008-01-31
Permanent URL
http://hdl.lib.byu.edu/1877/1460
Publisher
AIP
Language
English
College
Ira A. Fulton College of Engineering and Technology
Department
Chemical Engineering
Copyright Status
© 2008 American Institute of Physics. This article may be downloaded for personal use only. Any other use requires prior permission of the author and the American Institute of Physics. The following article appeared in The Journal of Chemical Physics and may be found at http://link.aip.org/link/?JCPSA6/106/10273/1
Copyright Use Information
http://lib.byu.edu/about/copyright/