Keywords

thermal diffusion, force-displacement ramp, heat transfer

Abstract

Thermal diffusion measurements on PMMA-coated Si substrates using heated AFM tips were performed to determine the contact resistance between an organic thin film and Si. The measurement methodology presented demonstrates how the thermal contrast signal obtained during a force-displacement ramp is used to quantify the resistance to heat transfer through an internal interface. The results also delineate the interrogation thickness beyond which thermal diffusion in the organic thin film is not affected appreciably by the underlying substrate.

Original Publication Citation

Iverson, B. D., Blendell, J. E., and Garimella, S. V., 2010, "Note: Thermal analog to atomic force microscopy force-displacement measurements for nanoscale interfacial contact resistance," Review of Scientific Instruments, Vol. 81. doi:10.1063/1.3361157