Keywords

molecular dynamics, intermolecular potentials, MPSA

Abstract

In superconformal filling of copper-chip interconnects, organic additives are used to fill high-aspect-ratio trenches or vias from the bottom up. In this study we report on the development of intermolecular potentials and use molecular dynamics simulation.

Original Publication Citation

Guymon, Clint G., John N. Harb, Richard L. Rowley, and Dean R. Wheeler. "MPSA effects on copper electrodeposition investigated by molecular dynamics simulations." The Journal of Chemical Physics 128 (28)

Document Type

Peer-Reviewed Article

Publication Date

2008-01-31

Permanent URL

http://hdl.lib.byu.edu/1877/1460

Publisher

AIP

Language

English

College

Ira A. Fulton College of Engineering and Technology

Department

Chemical Engineering

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