artificial neural networks, interconnect technology, multi-chip modules
The requirement for dense interconnect in artificial neural network systems has led researchers to seek high-density interconnect technologies. This paper reports an implementation using multi-chip modules (MCMs) as the interconnect medium. The specific system described is a self-organizing, parallel, and dynamic learning model which requires a dense interconnect technology for effective implementation; this requirement is fulfilled by exploiting MCM technology. The ideas presented in this paper regarding an MCM implementation of artificial neural networks are versatile and can be adapted to apply to other neural network and connectionist models.
Original Publication Citation
Stout, M., Salmon, L., Rudolph, G., and Martinez, T. R., "A Multi-Chip Module Implementation of a Neural Network", Proceedings of the IEEE Multi-Chip Module Conference MCMC-94, pp. 2-25, 1994.
BYU ScholarsArchive Citation
Martinez, Tony R.; Rudolph, George L.; Salmon, Linton G.; and Stout, Matthew G., "A Multi-Chip Module Implementation of a Neural Network" (1994). Faculty Publications. 1166.
Physical and Mathematical Sciences
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