Bottom-up self-assembly has the potential to fabricate nanostructures with advanced electrical features. DNA templates have been used to enable such self-assembling methods due to their versatility and compatibility with various nanomaterials. This dissertation describes research to advance several different steps of biotemplated nanofabrication, from DNA assembly to characterization. I assembled different nanomaterials including surfactant-coated Au nanorods, DNA-linked Au nanorods and Pd nanoparticles on DNA nanotubes ~10 micrometer long, and on ~400 nm long bar-shaped DNA origami templates. I optimized seeding by changing the surfactant and magnesium ion concentrations in the seeding solution. After successful seeding, I performed electroless plating on those nanostructures to fabricate continuous nanowires. Using the four-point probe technique, I performed resistivity measurements for Au nanowires on DNA nanotubes and obtained values between 9.3 x 10-6 and 1.2 x 10-3 ohm meter. Finally, I demonstrated the directed placement of DNA origami using block copolymer self-assembly. I created a gold nanodot array using block copolymer patterning and metal evaporation followed by lift-off. Then, I used different ligand groups and DNA hybridization to attach DNA origami to the nanodots. The DNA hybridization approach showed greater DNA attachment to Au nanodots than localization by electrostatic interaction. These results represent vital progress in understanding DNA-templated components, nanomaterials, and block copolymer nanolithography. The work in this dissertation shows potential for creating DNA-templated nanodevices and their placement in an ordered array in future nanoelectronics. Each of the described materials and techniques further has potential for addressing the need for increased complexity and integration for future applications.



College and Department

Physical and Mathematical Sciences; Chemistry and Biochemistry



Date Submitted


Document Type





block copolymer, DNA self-assembly, electrical characterization, electroless plating, metal nanorods, metal nanowires