This work presents the bottom-up fabrication of DNA origami-assembled metal nanowires and metal-semiconductor junctions, and their electrical characterization. Integration of metal and semiconductor nanomaterials into prescribed sites on self-assembled DNA origami has facilitated the fabrication of electronic nanomaterials, whereas use of conventional tools in their characterization combines bottom-up and top-down technologies. To expand the contemporary DNA-based nanofabrication into nanoelectronics, I performed site-specific metallization of DNA origami to create arbitrarily arranged gold nanostructures. I reported improved yields and conductivity measurements for Au nanowires created on DNA origami tile substrates. I measured the conductivity of C-shaped Au nanowires created on DNA tiles (âˆ¼130 nm long, 10 nm diameter, and 40 nm spacing between measurement points) with a four-point measurement technique which revealed the resistivity of the gold nanowires was as low as 4.24 Ã— 10-5 Î© m. Next, I fabricated DNA origami-templated metal-semiconductor junctions and performed electrical characterization. Au and Te nanorods were attached to DNA origami in an alternating fashion. Electroless gold plating was used to create nanoscale metal--semiconductor interfaces by filling the gaps between Au and Te nanorods. Two-point electrical characterization indicated that the Au--Te--Au junctions were electrically connected, with non-linear current--voltage curves. Finally, I formed metal-semiconductor nanowires on DNA origami by annealing polymer-encased nanorods. Polymer-coated Au and Te nanorods pre-attached to ribbon-shaped DNA origami were annealed at 170°C for 2 min. Gold migration occurred onto Te nanorods during annealing and established electrically continuous interfaces to give Au/Te nanowires. Electrical characterization of these Au/Te/Au assemblies revealed both nonlinear current-voltage curves and linear plots that are explained. The creation of electronic nanomaterials such as metal nanowires and metal-semiconductor junctions on DNA origami with multiple techniques advances DNA nanofabrication as a promising path toward future bottom-up fabrication of nanoelectronics.
College and Department
Physical and Mathematical Sciences
BYU ScholarsArchive Citation
Aryal, Basu Ram, "Bottom-Up Fabrication and Characterization of DNA Origami-Templated Electronic Nanomaterials" (2021). Theses and Dissertations. 9041.
DNA origami, nanowires, metal-semiconductor junctions, electrical characterization