Bistable microrelays have many possible applications and have the potential to reduce the size, weight, power consumption, and cost of products in which they are used. This research outlines the current state of microrelays, presents three new compliant bistable micromechanisms, and characterizes their performance as microrelays. The characterization includes a treatment of a new force-tester, a preliminary contact resistance study, contact-force measurements, switching time measurements, insertion loss, AC isolation, breakdown voltage, and DC isolation. This document also includes recommendations for further research.
College and Department
Ira A. Fulton College of Engineering and Technology; Mechanical Engineering
BYU ScholarsArchive Citation
Gomm, Troy Alan, "Development of In-Plane Compliant Bistable Microrelays" (2003). Theses and Dissertations. 81.
MEMS, microrelay, compliant mechanisms, in-plane compliant, bistable microrelays, bistable micromechanisms