Keywords
Bistable, compliant mechanism, micro relay, micro switch, pseudo-rigid-body model, thermal actuator
Abstract
A compliant bistable micromechanism has been developed which can be switched in either direction using on-chip thermal actuation. The energy storage and bistable behavior of the mechanism is achieved through the elastic deflection of compliant segments. The Pseudo-Rigid-Body Model was used for the compliant mechanism design, and for analysis of the large deflection flexible segments. To achieve on-chip actuation, the mechanism design was optimized to allow it to be switched using linear motion thermal actuators. The modeling theory and analysis are presented for three design iterations, with two iterations fabricated in the MUMP's process and the third in the SUMMiT process.
Original Publication Citation
Baker, M.S. and Howell, L.L., “On-Chip Actuation of an In-Plane Compliant Bistable Micromechanism,†Journal of Microelectromechanical Systems, Trans. IEEE and ASME, Vol. 11, No. 5, pp. 566-573, 22.
BYU ScholarsArchive Citation
Baker, Michael S. and Howell, Larry L., "On-Chip Actuation of an In-Plane Compliant Bistable Micromechanism" (2002). Faculty Publications. 519.
https://scholarsarchive.byu.edu/facpub/519
Document Type
Peer-Reviewed Article
Publication Date
2002-12-10
Permanent URL
http://hdl.lib.byu.edu/1877/1156
Publisher
IEEE
Language
English
College
Ira A. Fulton College of Engineering and Technology
Department
Mechanical Engineering
Copyright Status
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