Keywords

thermal resistance, thin film, atomic force microscopy, heat transfer

Abstract

Thermal diffusion measurements on polymethylmethacrylate-coated Si substrates using heated atomic force microscopy tips were performed to determine the contact resistance between an organic thin film and Si. The measurement methodology presented demonstrates how the thermal contrast signal obtained during a force-displacement ramp is used to quantify the resistance to heat transfer through an internal interface. The results also delineate the interrogation thickness beyond which thermal diffusion in the organic thin film is not affected appreciably by the underlying substrate.

Original Publication Citation

Iverson, B. D., Blendell, J. E., and Garimella, S. V., 2010, "Note: Thermal analog to atomic force microscopy force-displacement measurements for nanoscale interfacial contact resistance," Review of Scientific Instruments, Vol. 81. DOI: 10.1063/1.3361157

Document Type

Peer-Reviewed Article

Publication Date

2010-3

Publisher

AIP Publishing

Language

English

College

Ira A. Fulton College of Engineering and Technology

Department

Mechanical Engineering

University Standing at Time of Publication

Assistant Professor

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