polydimethylsiloxane, bonding, silicon, microfluidics
We investigate bonding polydimethylsiloxane (PDMS) to silicon using a thin (~2μm) intermediate adhesive layer stamped onto a PDMS piece prior to bonding. In particular, we compare as adhesive layers Sylgard 184 and 182 curing agents and a UV curable adhesive (NOA 75). We examine the effect of both curing temperature and duration on curing agent bond strength. Bond strengths for the different adhesives are determined by measuring the average burst pressure at a PDMS-silicon interface using a PDMS test design. We find that Sylgard 184 curing agent gives the highest bond strength with burst pressure of 700 kPa or more for curing at either 60◦C for 3 hours, 70◦C for 30 minutes, or 90◦C for 20 minutes. Curing at room temperature takes substantially more time with an average burst pressure of 433 and 555kPa for curing times of 16 and 27 hours, respectively. In comparison, Sylgard 182 curing agent takes 32 hours at room temperature to achieve a burst pressure of 289 kPa, while NOA 75 with a 50◦C 12 hour post-UV exposure bake yields a burst pressure of 125 kPa.
Tsai, Long-Fang; Dahlquist, William C.; Kim, Seunghyun; and Nordin, Gregory P., "Bonding of Polydimethylsiloxane Microfluidics to Silicon-Based Sensors" (2011). All Faculty Publications. Paper 78.
Society of Photo-optical Instrumentation Engineers
Long-Fang Tsai, William c. Dahlquist, Seunghyun Kim and Gregory P. Nordin, "Bonding of Polydimethylsiloxane Microfluidics to Silicon-Based Sensors", J. Micro/Nanolith. MEMS MOEMS 1, 439 (211), DOI: 1.1117/1.3659139
Ira A. Fulton College of Engineering and Technology
Electrical and Computer Engineering
© 2011 Society of Photo-Optical Instrumentation Engineers (SPIE).
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