molecular dynamics, intermolecular potentials, MPSA
In superconformal filling of copper-chip interconnects, organic additives are used to fill high-aspect-ratio trenches or vias from the bottom up. In this study we report on the development of intermolecular potentials and use molecular dynamics simulation.
Original Publication Citation
Guymon, Clint G., John N. Harb, Richard L. Rowley, and Dean R. Wheeler. "MPSA effects on copper electrodeposition investigated by molecular dynamics simulations." The Journal of Chemical Physics 128 (28)
BYU ScholarsArchive Citation
Harb, John N.; Rowley, Richard L.; Wheeler, Dean R.; and Guymon, Clint G., "MPSA effects on copper electrodeposition investigated by molecular dynamics simulations" (2008). All Faculty Publications. 211.
Ira A. Fulton College of Engineering and Technology
© 2008 American Institute of Physics. This article may be downloaded for personal use only. Any other use requires prior permission of the author and the American Institute of Physics. The following article appeared in The Journal of Chemical Physics and may be found at http://link.aip.org/link/?JCPSA6/106/10273/1
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