Abstract

Bistable microrelays have many possible applications and have the potential to reduce the size, weight, power consumption, and cost of products in which they are used. This research outlines the current state of microrelays, presents three new compliant bistable micromechanisms, and characterizes their performance as microrelays. The characterization includes a treatment of a new force-tester, a preliminary contact resistance study, contact-force measurements, switching time measurements, insertion loss, AC isolation, breakdown voltage, and DC isolation. This document also includes recommendations for further research.

Degree

MS

College and Department

Ira A. Fulton College of Engineering and Technology; Mechanical Engineering

Rights

http://lib.byu.edu/about/copyright/

Date Submitted

2003-06-17

Document Type

Thesis

Handle

http://hdl.lib.byu.edu/1877/etd225

Keywords

MEMS, microrelay, compliant mechanisms, in-plane compliant, bistable microrelays, bistable micromechanisms

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