Abstract

This thesis introduces two ortho-planar MEMS devices that can be used to position microcomponents: the XZ Micropositioning Mechanism and the XYZ Micromanipulator. The displacement and force relationships are presented. The devices were fabricated using surface micromachining processes and the resulting mechanisms were tested. A compliant XYZ Micromanipulator was also designed to reduce backlash and binding. In addition, several other MEMS positioners were fabricated and tested: the Micropositioning Platform Mechanism (MPM), the Ortho-planar Twisting Micromechanism (OTM), and the Ortho-planar Spring Micromechanism (OSM).

Degree

MS

College and Department

Ira A. Fulton College of Engineering and Technology; Mechanical Engineering

Rights

http://lib.byu.edu/about/copyright/

Date Submitted

2003-07-23

Document Type

Thesis

Handle

http://hdl.lib.byu.edu/1877/etd254

Keywords

MEMS, microelectromechanical systems, micropositioning, compliant mechanisms, out-of-plane, ortho-planar, surface micromachining, thermal actuation, thermomechanical in-plane microactuator, TIM

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